LOCTITE ECCOBOND UF 9000AE | 9000AE liquid epoxy underfill encapsulant is designed for large die flip chip BGA and Cu pillar package applications | UF9000AE (2024)

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  • LOCTITE ECCOBOND UF 9000AE

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ECCOBOND UF 9000AE | 9000AE liquid epoxy underfill encapsulant is designed for large die flip chip BGA and Cu pillar package applications | UF9000AE (5)

Main features

  • Low CTE
  • Low die warpage
  • 260°C reflow capability for Pb- free, low-k applications

Product Description

LOCTITE® ECCOBOND UF 9000AE liquid epoxy underfill encapsulant is designed for large die flip chip BGA and Cu pillar package applications requiring low thermal expansion, fast capillary flow, and long work-life.
LOCTITE® ECCOBOND UF 9000AEfully cured forms a rigid, self-filleting, protective seal that dissipates stress in solder joints extending electrical, thermal, and moisture reliability performance.

Cure schedule

15 minute ramp to 100°C;
90 minute hold @ 100°C+ 15 minute ramp from 100°C to 165°C;
2 hour hold @ 165°C

  • Specifications

Technical Specifications

General Properties
Pot Life

Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.

24 hours
Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.71
Shelf Life

Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.

Shelf Life @ -40°C 180 days
Physical Properties
Thixotropic index

Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.

0,085
Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

9,082 mPa.s
Mechanical Properties
Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C 13,500 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.

Coefficient of Thermal Expansion (CTE), α1

Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.

23 ppm/°C
Coefficient of Thermal Expansion (CTE), α2

Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.

85 ppm/°C
Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

111 °C

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LOCTITE ECCOBOND UF 9000AE | 9000AE liquid epoxy underfill encapsulant is designed for large die flip chip BGA and Cu pillar package applications | UF9000AE (2024)
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